Advanced plasma processing combined with trench isolation technology for fabrication and fast prototyping of high aspect ratio MEMS in standard silicon wafers
- 21 August 2004
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 14 (9), S70-S75
- https://doi.org/10.1088/0960-1317/14/9/012
Abstract
No abstract availableKeywords
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