Thermally conductive silicone rubber reinforced with boron nitride particle
Top Cited Papers
- 23 January 2007
- journal article
- research article
- Published by Wiley in Polymer Composites
- Vol. 28 (1), 23-28
- https://doi.org/10.1002/pc.20296
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Enhanced thermal conductivity of polymer composites filled with hybrid fillerComposites Part A: Applied Science and Manufacturing, 2006
- Evaluation for micro scale structures fabricated using epoxy-aluminum particle composite and its applicationJournal of the American Academy of Dermatology, 2005
- Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposesThermochimica Acta, 2005
- Preparation and properties of polyimide/aluminum nitride compositesPolymer Testing, 2004
- Thermally conducting aluminum nitride polymer-matrix compositesComposites Part A: Applied Science and Manufacturing, 2001
- Thermal characterization of an epoxy-based underfill material for flip chip packagingThermochimica Acta, 2000
- Orientation Specific Thermal Properties of Polyimide FilmJournal of Electronic Packaging, 2000
- Very high thermal conductivity obtained by boron nitride-filled polybenzoxazineThermochimica Acta, 1998
- Thermal Conductivity of Boron Carbide–Boron Nitride CompositesJournal of the American Ceramic Society, 1992
- Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier ResistanceJournal of Composite Materials, 1987