UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process
- 31 July 2013
- journal article
- Published by Elsevier BV in International Journal of Adhesion and Adhesives
- Vol. 44, 138-143
- https://doi.org/10.1016/j.ijadhadh.2013.02.005
Abstract
No abstract availableKeywords
Funding Information
- Korea Research Council for Industrial Science and Technology
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