Numerical Thermal Analysis to Study the Effect of Static Contact Angle on the Cooling Rate of a Molten Metal Droplet

Abstract
The present study is conducted to simulate the effect of molten metal droplet wettability on the solidification rate of a molten metal droplet. The effect of heat sink size, i.e., the thickness of substrate is also studied with respect to droplet solidification. It is found that the variation of contact angle has significant effect on the solidification time but the heat sink size does not effectively change the solidification time. It is also observed that the thermal diffusivity of substrate plays a dominant role in multimaterial systems.