Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45nm
- 30 November 2007
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 84 (11), 2610-2614
- https://doi.org/10.1016/j.mee.2007.06.014
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
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