First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm−2
- 1 June 2019
- journal article
- conference paper
- Published by IOP Publishing in Journal of Instrumentation
- Vol. 14 (06), C06018
- https://doi.org/10.1088/1748-0221/14/06/c06018
Abstract
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.This publication has 1 reference indexed in Scilit:
- An EUDET/AIDA Pixel Beam Telescope for Detector DevelopmentPhysics Procedia, 2012