Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications
- 1 January 2003
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 150 (3), C104-C110
- https://doi.org/10.1149/1.1541006
Abstract
The feasibility of using a thiosulfate-sulfite bath to electrodeposit soft gold for microelectronic applications has been investigated. This bath is stable at near-neutral pH, shows good compatibility with positive photoresists, and does not contain any additives. It was found that the bath produced gold bumps with straight sidewalls, flat top surfaces, and a good reproduction of the resist pattern was achieved. The thickness uniformity, roughness, stress, hardness, adhesion, and shape of the plated structures were found to be compatible with the requirements for a wide range of microelectronic applications, including wafer bumping. © 2003 The Electrochemical Society. All rights reserved.Keywords
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