Silver metallization for advanced interconnects
- 1 January 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Advanced Packaging
- Vol. 22 (1), 4-8
- https://doi.org/10.1109/6040.746536
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Stresses in thin film metallizationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- Stress-Induced Void Formation in Metal LinesMRS Bulletin, 1993
- Planarized Silver Interconnect Technology With A Ti Self-Passivation Technique For Deep Sub-Micron ULSIsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993