Direct observation of the 1/E dependence of time dependent dielectric breakdown in the presence of copper

Abstract
Time dependent dielectric breakdown (TDDB) lifetime model study has been performed on a metal-insulator-semiconductor capacitor structure with copper directly deposited on silicon dioxide without a barrier material. The structure generates a low electric field acceleration of time-to-failure, which makes it possible to measure TDDB over a wide range of electric fields from 3.5 to 10 MV/cm and experimentally validate TDDB lifetime model without any assumption and data extrapolation. The experimental results are in good agreement with the so called 1/E model and do not support the E , E , or power-law model.