Effects of support method and mechanical property of 300mm silicon wafer on sori measurement
- 1 January 2005
- journal article
- Published by Elsevier BV in Precision Engineering
- Vol. 29 (1), 19-26
- https://doi.org/10.1016/j.precisioneng.2004.03.004
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- A compact and sensitive two-dimensional angle probe for flatness measurement of large silicon wafersPrecision Engineering, 2002
- Design of an optical probe for surface profile measurementOptical Engineering, 1999
- Self-Calibration: Reversal, Redundancy, Error Separation, and ‘Absolute Testing’CIRP Annals, 1996