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Effect of Polishing Pad Material Properties on Chemical Mechanical Polishing (Cmp) Processes
Home
Publications
Effect of Polishing Pad Material Properties on Chemical Mechanical Polishing (Cmp) Processes
Effect of Polishing Pad Material Properties on Chemical Mechanical Polishing (Cmp) Processes
RB
Rajeev Bajaj
Rajeev Bajaj
MD
Mukesh Desai
Mukesh Desai
RJ
Rahul Jairath
Rahul Jairath
MS
Matthew Stell
Matthew Stell
RT
Robert Tolles
Robert Tolles
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1 January 1994
journal article
Published by
Springer Science and Business Media LLC
in
MRS Proceedings
Vol. 337
https://doi.org/10.1557/proc-337-637
Abstract
No abstract available
Keywords
POLISHING
CMP
FUNCTION
POLYURETHANE
PLANARITY
PAD MATERIAL
STIFFNESS
STRUCTURE
REMOVAL
Cited by 38 articles