Novel lamination and interconnection technologies demonstrated in a flexible modular optical sensor array for wound monitoring
- 31 August 2010
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 87 (5-8), 769-772
- https://doi.org/10.1016/j.mee.2009.11.121
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- In plane optical sensor based on organic electronic devicesPublished by SPIE-Intl Soc Optical Eng ,2008
- Optical sensor platforms by modular assembly of organic electronic devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2008
- Optical sensor array platform based on polymer electronic devicesPublished by SPIE-Intl Soc Optical Eng ,2007