Self-Terminating Growth of Platinum Films by Electrochemical Deposition
- 7 December 2012
- journal article
- other
- Published by American Association for the Advancement of Science (AAAS) in Science
- Vol. 338 (6112), 1327-1330
- https://doi.org/10.1126/science.1228925
Abstract
Atomic Layers from Solution: Growth of flat thin films is often plagued by the formation of mounds and pyramids. To avoid this problem, atomic-layer deposition (ALD) can be used whereby alternating self-termination reactions stop the layer growth. Electrochemical approaches to ALD use surface alloys to slow film growth, but often lead to film contamination. Yihua Liu et al. (p. 1327 ; see the Perspective by Switzer ) show that for platinum films, controlling surface potential can lead to adsorbed hydrogen on the surface, which can terminate film growth at one layer, leaving platinum species in solution available for further reduction. Rapid changes in applied potential can oxidize the hydrogen, which allows efficient contamination-free growth of an additional atomic layer.Keywords
This publication has 24 references indexed in Scilit:
- Blank voltammetry of hexagonal surfaces of Pt-group metal electrodes: Comparison to density functional theory calculations and ultra-high vacuum experiments on water dissociationElectrochimica Acta, 2011
- Deposition of platinum monolayers on goldJournal of Solid State Electrochemistry, 2011
- Discovery of the Potential of Minimum Mass for Platinum ElectrodesLangmuir, 2011
- Resonance surface X-ray scattering technique to determine the structure of electrodeposited Pt ultrathin layers on Au(111) surfaceElectrochimica Acta, 2010
- Electrochemistry and the Future of the AutomobileThe Journal of Physical Chemistry Letters, 2010
- Entropy Effects in Atom Distribution and Electrochemical Properties of AuxPt1−x/Pt(111) Surface AlloysChemphyschem, 2010
- Adsorption of hydrogen on Pt(111) and Pt(100) surfaces and its role in the HORElectrochemistry Communications, 2008
- Trends in electrocatalysis on extended and nanoscale Pt-bimetallic alloy surfacesNature Materials, 2007
- Metal monolayer deposition by replacement of metal adlayers on electrode surfacesSurface Science, 2001
- Studies of platinum electroplating baths Part III. The electrochemistry of Pt(NH3)4 − x(H2O)2+2 and PtCl4 − x(H2O)(2 − x)−xJournal of Electroanalytical Chemistry, 1995