Studies of Bonding Mechanisms and Failure Modes in Thermocompression Bonds of Gold Plated Leads to Ti-Au Metallized Substrates
- 1 March 1971
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
- No. 07350791,p. 178-186
- https://doi.org/10.1109/irps.1971.362512