Interfacial reactions between lead-free solders and common base materials
Top Cited Papers
- 1 March 2005
- journal article
- review article
- Published by Elsevier BV in Materials Science and Engineering: R: Reports
- Vol. 49 (1-2), 1-60
- https://doi.org/10.1016/j.mser.2005.03.001
Abstract
No abstract availableKeywords
This publication has 79 references indexed in Scilit:
- Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packagingJournal of Materials Research, 2004
- Thermal stability of electroless-nickel/solder interface: Part A. interfacial chemistry and microstructureMetallurgical and Materials Transactions A, 2000
- Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examplesMaterials Science and Engineering: A, 1997
- Determination of tin bulk diffusion in AgSn alloys via surface segregationScripta Metallurgica et Materialia, 1990
- Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 KJournal of Materials Science, 1987
- Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interfaceScripta Metallurgica, 1980
- Silver and tin bulk diffusion in AgSn alloysScripta Metallurgica, 1978
- Thin film interdiffusion of Au and Sn at room temperatureJournal of the Less Common Metals, 1977
- Kristallstruktur von NiSnJournal of the Less Common Metals, 1973
- Kirkendall effect studies in copper-tin diffusion couplesScripta Metallurgica, 1972