3D Multi-chip Integration with System on Integrated Chips (SoIC™)
- 1 June 2019
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration PlatformsIEEE Transactions on Electron Devices, 2018
- Comprehensive device and product level reliability studies on advanced CMOS technologies featuring 7nm high-k metal gate FinFET transistorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2018
- System scaling for intelligent ubiquitous computingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2017