Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips
- 1 December 1990
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 112 (4), 375-382
- https://doi.org/10.1115/1.2904392