Ultra-Low Dielectric Permitfivity Ceramics and Composites for Packaging Applications
- 1 January 1986
- journal article
- Published by Springer Science and Business Media LLC in MRS Proceedings
- Vol. 72, 53
- https://doi.org/10.1557/proc-72-53
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- A Ceramic Capacitor Substrate for High Speed Switching VLSI ChipsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
- Gel Method for Making GlassPublished by Elsevier BV ,1982
- Thermal Conduction Module: A High-Performance Multilayer Ceramic PackageIBM Journal of Research and Development, 1982