A NUMERICAL MODEL FOR PHASE-CHANGE SUSPENSION FLOW IN MICROCHANNELS
- 1 July 2004
- journal article
- research article
- Published by Informa UK Limited in Numerical Heat Transfer, Part A: Applications
- Vol. 46 (1), 55-77
- https://doi.org/10.1080/10407780490457545
Abstract
A model is developed for simulation of the laminar hydrodynamic and heat transfer characteristics of suspension flow with micro-nano-size phase-change material (PCM) particles in a microchannel ( D / d p = 12.2–500). The demonstrated simultaneous solutions for the two-phase conservation equations of mass, momentum, and energy allow the investigation of heat transfer enhancement mechanisms and their limits, due to nonthermal equilibrium melting of PCM suspension particles in a flow, such as the existence of a particle-depleted layer, particle–wall interaction, phase-change (melting) region propagation, and local heat transfer coefficients for both constant wall heat flux and constant wall temperature boundary conditions.Keywords
This publication has 17 references indexed in Scilit:
- Non-thermal equilibrium melting of granular packed bed in horizontal forced convection. Part II: numerical simulationInternational Journal of Heat and Mass Transfer, 2003
- Non-thermal equilibrium melting of granular packed bed in horizontal forced convection. Part I: experimentInternational Journal of Heat and Mass Transfer, 2003
- Contact melting of a phase change material inside a heated parallelepedic capsuleEnergy Conversion and Management, 2001
- Thermal Conductivity of Nanoparticle - Fluid MixtureJournal of Thermophysics and Heat Transfer, 1999
- Characteristics of microencapsulated PCM slurry as a heat‐transfer fluidAIChE Journal, 1999
- The Fluid Mechanics of Microdevices—The Freeman Scholar LectureJournal of Fluids Engineering, 1999
- Ultimate theoretical models of nanocomputersNanotechnology, 1998
- Porosity distributions in a fluidized bed with an immersed obstacleAIChE Journal, 1989
- Hydrodynamics of Fiuidizatlon and Heat Transfer: Supercomputer ModelingApplied Mechanics Reviews, 1986
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981