Diffusion bonding of Al7075 to Ti–6Al–4V using Cu coatings and Sn–3.6Ag–1Cu interlayers
- 2 April 2010
- journal article
- research article
- Published by Elsevier BV in Journal of Alloys and Compounds
- Vol. 494 (1-2), 351-358
- https://doi.org/10.1016/j.jallcom.2010.01.037
Abstract
No abstract availableKeywords
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