Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions
- 18 December 2014
- journal article
- Published by Springer Science and Business Media LLC in Journal of Materials Science: Materials in Electronics
- Vol. 26 (3), 1649-1660
- https://doi.org/10.1007/s10854-014-2589-4
Abstract
No abstract availableKeywords
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