Effects of the size and filler loading on the properties of copper‐ and silver‐nanoparticle‐filled epoxy composites
- 6 April 2011
- journal article
- research article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 121 (6), 3145-3152
- https://doi.org/10.1002/app.33798
Abstract
No abstract availableKeywords
Funding Information
- Intel Technology (M) Bhd. student scholarship granted to K. L. Chan
- Ministry of Higher Education of Malaysia and University Sains Malaysia (1001/PBAHAN/814055)
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