Combinatorial fabrication and high-throughput characterization of a Ti–Ni–Cu shape memory thin film composition spread
- 25 May 2008
- journal article
- Published by Elsevier BV in Materials Science and Engineering: A
- Vol. 481-482, 151-155
- https://doi.org/10.1016/j.msea.2007.02.168
Abstract
No abstract availableKeywords
Funding Information
- Deutsche Forschungsgemeinschaft (B9, SFB 459)
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