Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures
- 1 July 2005
- journal article
- Published by Elsevier BV in Microelectronics Journal
- Vol. 36 (7), 673-677
- https://doi.org/10.1016/j.mejo.2005.04.039
Abstract
No abstract availableKeywords
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- Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperaturesJournal of Microelectromechanical Systems, 2002
- Micromachining of buried micro channels in siliconJournal of Microelectromechanical Systems, 2000
- SCREAM MicroElectroMechanical SystemsMicroelectronic Engineering, 1996