A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits
- 1 July 2012
- journal article
- Published by Elsevier BV in Scripta Materialia
- Vol. 67 (2), 197-200
- https://doi.org/10.1016/j.scriptamat.2012.04.017
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Nanoscale Material Removal Mechanism of Soft-Brittle HgCdTe Single Crystals Under Nanogrinding by Ultrafine Diamond GritsTribology Letters, 2012
- Phase transformation of single crystal silicon induced by grinding with ultrafine diamond gritsScripta Materialia, 2011
- New deformation mechanism of soft-brittle CdZnTe single crystals under nanogrindingScripta Materialia, 2010
- Heat flux distributions and convective heat transfer in deep grindingInternational Journal of Machine Tools and Manufacture, 2006
- Grinding force and power modeling based on chip thickness analysisThe International Journal of Advanced Manufacturing Technology, 2006
- Nanoindentation of HgCdTe prepared by molecular beam epitaxyApplied Physics Letters, 2005
- Wear of Electroplated CBN Grinding WheelsJournal of Manufacturing Science and Engineering, 2005
- A new chip-thickness model for performance assessment of silicon carbide grindingThe International Journal of Advanced Manufacturing Technology, 2004
- Forces and Energy in Circular Sawing and Grinding of GraniteJournal of Manufacturing Science and Engineering, 2000
- Grinding Mechanisms for CeramicsCIRP Annals, 1996