Direct strain measurement in a 65nm node strained silicon transistor by convergent-beam electron diffraction
- 16 October 2006
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 89 (16), 161907
- https://doi.org/10.1063/1.2362978
Abstract
Using the energy-filtered convergent-beam electron diffraction (CBED) technique in a transmission electron microscope, the authors report here a direct measurement of the lattice parameters of uniaxially strained silicon as close as below the gate in a node -type metal-oxide-semiconductor field-effect transistor with SiGe source and drain. It is found that the dominant strain component (0.58%) is compressive along the source-drain direction. The compressive stress is along this direction. These findings demonstrate that CBED can serve as a strain metrology technique for the development of strained silicon device technology.
Keywords
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