Germanium n-type shallow junction activation dependences

Abstract

A few of the recent unsatisfactory germanium $n$ -channel metal-oxide-semiconductor field-effect transistor MOSFET experimentations are believed to stem from the poor source and drain $n^{+}\text{‐}p$ junction formations. In order to explain the primary cause and suggest rectifying solutions, we have examined the activation of common $n$ -type dopants in germanium and the related dependences. These dependences include thermal anneal budget, impurity species, and implantation dosage. Low thermal budgets are generally preferred to activate shallow junctions to simultaneously annihilate defects and suppress fast dopant diffusion. Injecting dopants over the solid-solubility limitation into shallow junctions would only generate more implantation damage but could not however lower the junction sheet resistance.