Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package
- 31 May 2012
- journal article
- Published by Elsevier BV in Microelectronics Reliability
- Vol. 52 (5), 855-860
- https://doi.org/10.1016/j.microrel.2011.05.002
Abstract
No abstract availableKeywords
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