Thermal analysis of thermal spreaders used in power electronics cooling
- 25 June 2003
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Flat Miniature Heat Pipes With Micro Capillary GroovesJournal of Heat Transfer, 1999
- ULTRAHIGH-CAPACITY MICROMACHINED HEAT SPREADERSMicroscale Thermophysical Engineering, 1998
- Experiments and Analyses of Flat Miniature Heat PipesJournal of Thermophysics and Heat Transfer, 1997