Thermal modeling and analysis of advanced 3D stacked structures
Open Access
- 31 December 2012
- journal article
- Published by Elsevier BV in Procedia Engineering
- Vol. 30, 248-257
- https://doi.org/10.1016/j.proeng.2012.01.858
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Interface thermal characteristics of flip chip packages – A numerical studyApplied Thermal Engineering, 2009
- Full-Wave Simulation of Time Modulated Linear Antenna Arrays in Frequency DomainIEEE Transactions on Antennas and Propagation, 2008