A high-yield microassembly structure for three-dimensional microelectrode arrays
Top Cited Papers
- 1 March 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Biomedical Engineering
- Vol. 47 (3), 281-289
- https://doi.org/10.1109/10.827288
Abstract
This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.Keywords
This publication has 16 references indexed in Scilit:
- A technique for electrically inserting electrode arrays into peripheral nervesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Single-unit neural recording with active microelectrode arraysIEEE Transactions on Biomedical Engineering, 2001
- A high-yield microassembly structure for three-dimensional microelectrode arraysIEEE Transactions on Biomedical Engineering, 2000
- Multiple single-unit recordings from the CNS using thin-film electrode arraysIEEE Transactions on Rehabilitation Engineering, 1993
- A method for pneumatically inserting an array of penetrating electrodes into cortical tissueAnnals of Biomedical Engineering, 1992
- Factors influencing the biocompatibility of insertable silicon microshafts in cerebral cortexIEEE Transactions on Biomedical Engineering, 1992
- An implantable CMOS circuit interface for multiplexed microelectrode recording arraysIEEE Journal of Solid-State Circuits, 1992
- A method for the study of undecalcified bones and teeth with attached soft tissues*Journal of Oral Pathology & Medicine, 1982
- Beam-Lead TechnologyBell System Technical Journal, 1966