Adaptive modeling of the transients of submicron integrated circuits [monolithic microwave devices]
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 21 (3), 412-417
- https://doi.org/10.1109/95.725204
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- An exact solution of the steady-state surface temperature for a general multilayer structurePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- GaAs MMIC thermal modeling for channel temperatures in accelerated life test fixtures and microwave modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Modeling of MMIC devices for determining MMIC channel temperatures during life testsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A new, efficient approach to the large-scale thermal modeling of III-V devices and integrated circuitsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- Transient thermal study of semiconductor devicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Thermal properties of five-layer infinite plate structures with embedded heat sourcesJournal of Applied Physics, 1989
- Thermal analysis of multiple-layer structuresIEEE Transactions on Electron Devices, 1974