Thermal characterisation of power modules
- 1 January 2000
- journal article
- Published by Elsevier BV in Microelectronics Reliability
- Vol. 40 (1), 155-161
- https://doi.org/10.1016/s0026-2714(99)00151-1
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- A closed form solution of junction to substrate thermal resistance in semiconductor chipsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1996
- Approximate formulas for the thermal resistance of IMPATT diodes compared with computer calculationsIEEE Transactions on Electron Devices, 1977