Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications
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- 2 December 2008
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Advanced Packaging
- Vol. 31 (4), 759-767
- https://doi.org/10.1109/tadvp.2008.2005996
Abstract
On the basis of a realized 12times10 Gb/s card-to-card optical link demonstrator, the capabilities of a polymer-waveguide-based board-level optical interconnect technology are presented. The conception and realization of the modular building blocks required for this board-level optical interconnect technology are described in detail. In particular, we report on the fabrication and characterization of board-integrated optical low-loss polymer waveguides that are compatible with printed circuit board (PCB) manufacturing processes. We also explain our fully passive alignment technique, superseding time-consuming active positioning of components and connectors. To realize optical transceiver modules comprising vertical cavity surface emitting laser (VCSEL) arrays with laser drivers and photodetector arrays with transimpedance amplifiers (TIAs), a mass-production concept based on wafer-level processing has been elaborated and successfully implemented.Keywords
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