Performance of any layer IVH structure multi-layered printed wiring board
- 19 November 2002
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
We have developed a new multi-layered printed wiring board (ML-PWB) with any layer IVH structure, dubbed "ALIVH"(Any Layer Inner Via Hole). This ALIVH design combines epoxy impregnated non-woven aramid laminates, via hole processing technology using a CO/sub 2/ laser and interconnection technology using conductive copper paste. Non-woven aramid made of extra strong and high thermal resistant aramid fiber has low dielectric constant and is light weight. Non-woven aramid laminates has excellent flatness and low thermal expansion coefficiency in plane. Therefore, ALIVH has a great potential to cope with flip chip bonding technology for MCM-L applications.Keywords
This publication has 1 reference indexed in Scilit:
- A Stud-bump-bonding Technique For High Density Multi-chip-modulePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005