Effect of thermal cycling on the expansion behavior of Al/SiCp composite
- 1 February 2009
- journal article
- Published by Elsevier BV in Journal of the American Academy of Dermatology
- Vol. 209 (3), 1471-1476
- https://doi.org/10.1016/j.jmatprotec.2008.03.054
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCp/Al compositeMaterials Chemistry and Physics, 2001
- Thermal stresses due to spheroidal inclusionsMaterials Chemistry and Physics, 1999
- Dependence of thermal residual stress on temperature in a SiC particle-reinforced 6061Al alloyMetallurgical and Materials Transactions, 1998
- Elastoplastic analysis of thermal cycling: Ceramic particles in a metallic matrixJournal of the Mechanics and Physics of Solids, 1995
- Analytical study for the stress analysis of Metal Matrix CompositesJournal of the American Academy of Dermatology, 1994
- Thermal stress and strain in a metal matrix Composite with a Spherical Reinforcement ParticleMetallurgical Transactions A, 1992
- The deformation of particle reinforced metal matrix composites during temperature cyclingActa Metallurgica et Materialia, 1990
- Prediction of Coefficients of Thermal Expansion for Unidirectional CompositesJournal of Composite Materials, 1989
- Coefficient of Thermal Expansion for Composites with Randomly Oriented FibersJournal of Composite Materials, 1981
- The physical properties of composite materialsJournal of Materials Science, 1976