The work-hardening of copper-silica

Abstract

A method is described for the determination of the surface diffusion coefficient in a copper-silica interface. The experimental values thus obtained are applied to a simple model for the relaxation of stresses produced at a silica particle, in a copper matrix, by applied plastic and elastic deformations. The usefulness of the model is examined in terms of its application to the prediction of the conditions under which diffusion-aided relaxation becomes important.