Advanced multilayer metallization schemes with copper as interconnection metal
- 1 December 1993
- journal article
- Published by Elsevier BV in Thin Solid Films
- Vol. 236 (1-2), 257-266
- https://doi.org/10.1016/0040-6090(93)90680-n
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
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