Die singulation technologies for advanced packaging: A critical review
- 6 April 2012
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B
- Vol. 30 (4)
- https://doi.org/10.1116/1.3700230
Abstract
No abstract availableThis publication has 104 references indexed in Scilit:
- Challenges in the Assembly and Handling of Thin Film Capped MEMS DevicesSensors, 2010
- Theory analysis of wavelength dependence of laser-induced phase explosion of siliconJournal of Applied Physics, 2008
- Grinding wheels for manufacturing of silicon wafers: A literature reviewInternational Journal of Machine Tools and Manufacture, 2007
- Laser Singulation of Thin Wafers & Difficult Processed Substrates: A Niche Area over Saw DicingJournal of Laser Micro/Nanoengineering, 2006
- Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce ChippingIEEE Transactions on Electronics Packaging Manufacturing, 2006
- From crack deflection to lattice vibrations—macro to atomistic examination of dynamic cleavage fractureJournal of the Mechanics and Physics of Solids, 2004
- Models for Laser Ablation of PolymersChemical Reviews, 2003
- Modelling of high-density laser-material interaction using fast level set methodJournal of Physics D: Applied Physics, 2001
- Die cracking and reliable die design for flip-chip assembliesIEEE Transactions on Advanced Packaging, 1999
- Grinding induced subsurface cracks in silicon wafersInternational Journal of Machine Tools and Manufacture, 1999