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The emergence of stacked 3D silicon and its impact on microelectronics systems integration
Home
Publications
The emergence of stacked 3D silicon and its impact on microelectronics systems integration
The emergence of stacked 3D silicon and its impact on microelectronics systems integration
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J. Carson
J. Carson
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24 December 2002
conference paper
conference paper
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/iciss.1996.552405
Abstract
No abstract available
Cited by 11 articles