Thermal and mechanical analysis of photoresist and silylated photoresist films: Application to AZ 5214™
- 31 January 1996
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 30 (1-4), 267-270
- https://doi.org/10.1016/0167-9317(95)00242-1
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- A new method which increases the Si content in wet silylation, and its relation to the thermal effects during O2 plasma developmentMicroelectronic Engineering, 1995
- Melt flow of the silylated areas during the desire processMicroelectronic Engineering, 1993
- Plasma etching of polymers: A reinvestigation of temperature effectsJournal of Applied Physics, 1991
- Application of thermal analysis techniques to appraisal and quality control in JapanIEEE Electrical Insulation Magazine, 1990