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The 300 mm silicon wafer — a cost and technology challenge
Home
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The 300 mm silicon wafer — a cost and technology challenge
The 300 mm silicon wafer — a cost and technology challenge
Peter O. Hahn
Peter O. Hahn
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31 May 2001
journal article
Published by
Elsevier BV
in
Microelectronic Engineering
Vol. 56
(1)
,
3-13
https://doi.org/10.1016/s0167-9317(00)00499-8
Abstract
No abstract available
Keywords
SILICON WAFERS
Cited by 43 articles