Electronic Packaging: Heat Sink Materials
- 1 January 2001
- book chapter
- Published by Elsevier BV
- p. 2676-2682
- https://doi.org/10.1016/b0-08-043152-6/00479-4
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
This publication has 3 references indexed in Scilit: