Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails
- 20 November 2009
- journal article
- research article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Components Letters
- Vol. 20 (1), 31-33
- https://doi.org/10.1109/lmwc.2009.2035960
Abstract
The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits.Keywords
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