Fusing silicon wafers with low melting temperature glass
- 30 April 1990
- journal article
- Published by Elsevier BV in Sensors and Actuators A: Physical
- Vol. 23 (1-3), 935-938
- https://doi.org/10.1016/0924-4247(90)87063-o
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Silicon and silicon dioxide thermal bonding for silicon-on-insulator applicationsJournal of Applied Physics, 1988