Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application
- 3 April 2012
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging and Manufacturing Technology
- Vol. 2 (5), 841-846
- https://doi.org/10.1109/tcpmt.2012.2188293
Abstract
This paper presents a cavity-backed slot (CBS) antenna for millimeter-wave applications. The cavity of the antenna is fully filled by polymer material. This filling makes the fabrication of a silicon CBS antenna feasible, reduces the cavity size by 76.8%, and also maintains the inherent high-gain and wide bandwidth. In addition, a through-silicon via-based architecture is proposed to integrate the 135-GHz CBS antenna with active circuits for a complete system-in-package. Results show that the proposed structure not only reduces the footprint size but also suppresses the electromagnetic interference.Keywords
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