Nano-grained copper strip produced by accumulative roll bonding process
Top Cited Papers
- 25 January 2008
- journal article
- Published by Elsevier BV in Materials Science and Engineering: A
- Vol. 473 (1-2), 28-33
- https://doi.org/10.1016/j.msea.2007.03.065
Abstract
No abstract availableKeywords
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