High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure
- 1 February 2012
- journal article
- Published by Elsevier BV in Microelectronics Reliability
- Vol. 52 (2), 434-438
- https://doi.org/10.1016/j.microrel.2011.09.021
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
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