Combinatorial approach to the edge delamination test for thin film reliability—concept and simulation
- 1 August 2003
- journal article
- Published by Elsevier BV in Thin Solid Films
- Vol. 437 (1-2), 197-203
- https://doi.org/10.1016/s0040-6090(03)00585-6
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- A Combinatorial Approach for Structural MaterialsAdvanced Engineering Materials, 2001
- Relative Adhesion Measurement for Thin Film Microelectronics StructuresThe Journal of Adhesion, 2000
- Designing reliable polymer coatingsPolymer Engineering & Science, 1996
- On the significance of the logarithmic term in the free edge stress singularity of composite laminatesInternational Journal of Solids and Structures, 1989
- A Self-Delamination Method of Measuring the Surface Energy of Adhesion of CoatingsThe Journal of Adhesion, 1988
- Selected bibliography on adhesion measurement of films and coatingsJournal of Adhesion Science and Technology, 1987
- Edge singularities in anisotropic compositesInternational Journal of Solids and Structures, 1981
- Interfacial chemistry and adhesion: recent developments and prospectsPublished by Walter de Gruyter GmbH ,1980
- Interlaminar Stresses in Composite Laminates Under Uniform Axial ExtensionJournal of Composite Materials, 1970
- Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear LoadingJournal of Applied Mechanics, 1968