A Modular 1 mm$^{3}$ Die-Stacked Sensing Platform With Low Power I$^{2}$C Inter-Die Communication and Multi-Modal Energy Harvesting
Top Cited Papers
- 12 December 2012
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Solid-State Circuits
- Vol. 48 (1), 229-243
- https://doi.org/10.1109/jssc.2012.2221233
Abstract
A 1.0 mm3 general-purpose sensor node platform with heterogeneous multi-layer structure is proposed. The sensor platform benefits from modularity by allowing the addition/removal of IC layers. A new low power I2C interface is introduced for energy efficient inter-layer communication with compatibility to commercial I2C protocols. A self-adapting power management unit is proposed for efficient battery voltage down conversion for wide range of battery voltages and load current. The power management unit also adapts itself by monitoring energy harvesting conditions and harvesting sources and is capable of harvesting from solar, thermal and microbial fuel cells. An optical wakeup receiver is proposed for sensor node programming and synchronization with 228 pW standby power. The system also includes two processors, timer, temperature sensor, and low-power imager. Standby power of the system is 11 nW.Keywords
This publication has 13 references indexed in Scilit:
- A cubic-millimeter energy-autonomous wireless intraocular pressure monitorPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2011
- A 660pW multi-stage temperature-compensated timer for ultra-low-power wireless sensor node synchronizationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2011
- Millimeter-scale nearly perpetual sensor system with stacked battery and solar cellsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2010
- A Fault Tolerant Wired/Wireless Sensor Network Architecture for Monitoring Pipeline InfrastructuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2008
- A sub-pW timer using gate leakage for ultra low-power sub-Hz monitoring systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2007
- A 5.3GHz 8T-SRAM with Operation Down to 0.41V in 65nm CMOSPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2007
- Minimizing HVAC Energy Consumption Using a Wireless Sensor NetworkPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2007
- Feasibility of structural monitoring with vibration powered sensorsSmart Materials and Structures, 2006
- Research challenges in wireless networks of biomedical sensorsPublished by Association for Computing Machinery (ACM) ,2001
- Smart Dust: communicating with a cubic-millimeter computerComputer, 2001